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COSTA MESA, Calif., August 22, 2003. Irvine Sensors has successfully developed and demonstrated an entire computer system that could fit inside a wristwatch. Using its patented Neo-Stacking technology, Irvine Sensors has stacked and integrated a complete, commercially standard suite of electronics to produce a miniaturized high performance computer in an assembly that is approximately one inch square by 1/2 inch high. The system has interfaces and support for a LCD display, mouse, keyboard, USB 1.1 host controller, and various other forms of external input and output. It uses less than two watts of power when operating.
The Neo-Stacked computer includes an Intel 32-bit SA-1110 StrongARM 206 MHz processor, the Intel SA-1111 StrongARM companion chip, a Xilinx Coolrunner XCR3256XL CPLD, 256 Mb of Intel StrataFlash boot flash, 1024 Mb of Micron SDRAM memory, 8Gb of solid-state storage using 16 Samsung Flash memory chips, a processor clock, a real time clock, arrays of required resistors and capacitors, a variety of interface ports including USB, UART, IrDA, SSP, PS/2, audio and video plus miscellaneous other parts required for a complete computer system. Its standard operating system permits it to use widely available commercial software.
"We undertook this development to initially address military requirements for highly miniaturized embedded computers. However, we expect that in sufficient volumes, the costs of such computers could be reduced to levels that would be commercially attractive," said John C. Carson, Irvine Sensors President. "Since we have recently seen industry announcements of much less ambitious packaging demonstrations, we thought it was about time to let the world know about the rapidly increasing maturity of our technology and what we believe can be accomplished with Neo-Stacking today. We invite systems developers to get in touch with us to discuss Neo-Stacking solutions to their applications challenges," Mr. Carson concluded.
Irvine Sensors Corporation, headquartered in Costa Mesa, California, is primarily engaged in the sale of stacked chip assemblies and research and development related to high density electronics, miniaturized sensors and cameras, optical interconnection technology, high speed routers, image processing and low-power analog and mixed-signal integrated circuits for diverse systems applications.
Military & Aerospace Electronics
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