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SAN DIEGO, Calif., 18 Nov. 2008. CSP Inc.'s MultiComputer Division, a supplier of rugged embedded clusters, revealed during MILCOM 2008 that the company is expanding its FastCluster product line with the introduction of chassis utilizing SprayCool thermal management.
Under an agreement with SprayCool (formerly Isothermal Systems Research) of Liberty Lake, Wa., CSPI will integrate its 3000 Series payloads into an enclosure with SprayCool's liquid cooling technology to enable high-performance digital signal processing (DSP), SIGINT, and C4ISR applications in airborne, shipboard, and UAV platforms destined for deployment in extreme environmental conditions.
"Today's military applications challenge suppliers to deliver maximum processing density in a package that can operate reliably under harsh conditions," says Alexander R. Lupinetti, chairman and CEO of CSP Inc. "Our partnership with SprayCool allows us to meet this challenge head on, delivering field proven capabilities in a system that is lightweight, compact, and capable of unprecedented compute power per cubic foot."
SprayCool's patented two-phase liquid cooling
technology uses a fine mist of non-corrosive, non-conductive liquid, sprayed in a thin layer, which evaporates and cools electronics. The process continuously cycles within a sealed, closed loop system.
Matt Gerber, CEO and president of SprayCool says: "Combining SprayCool's thermal management with the FastCluster open architecture delivers a scalable, high-performance computing platform to DOD SWaP constrained applications."
Capable of cooling in excess of 500 watts per slot in an unpressurized environment, SprayCool sealed enclosures isolate the electronics from dirty and corrosive environments, while enabling cooler, higher performance, and more durable electronic devices.
"SprayCool's two-phase liquid cooling approach not only delivers a proven solution to the thermal management
of current FastCluster rugged platforms, but additionally addresses the foreseeable increase in heat density
associated with our multicore processing roadmap," says Bernard Pelon, director of product research.
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