Conduction Cooling Techniques for Rugged Computers
Conduction cooling for modular embedded computers has been used for many years in applications where air cooling is not appropriate. Standardization efforts have helped to maintain interoperability of COTS products. Conduction cooled design techniques are continuously improving to meet the requirements for higher power dissipation and lower price. This paper will examine why applications use conduction cooled boards, the concept of the Ruggedizer and ways to extend thermal performance.